This following Ulti-Mate Connector white paper provides insight how using the flat edge of beryllium cooper stock instead of round results in improved contact consistency and mechanical strength of the compliant pin and socket designs. It is well established that a flat contact for Micro and Nano Connectors are more predictably formed for consistent processing in assembly.

When your design requires high density, high grade .025” pitch interconnect to support your criteria, there is a lot to consider when specifying a “Nano” size connector. Not the least of which is choosing a component that will reduce or eliminate costly delays, redesign and rework. The following whitepaper offers some practical insight that will assist you and your team in making your best, most reliable interconnect choices.