Electronic systems and subsystems have continuously shrunk in size and weight while still requiring high-performance specifications. Consequently, surface-mounted connectors have evolved in kind, from Military Circular connectors and D-Subminiature to Micro-Ds to today’s top technology: Nano-Ds. Despite the abundance of suppliers in the market, quality and production issues have persisted as they try to balance size constraints vs performance requirements.

The following Article was written by one of our senior members on the capabilities of our much smaller, yet consistent micro and nano connectors. Explore and see why choosing the right connector at the early stages is crucial to a manufacturing projects.

This following Ulti-Mate Connector white paper provides insight how using the flat edge of beryllium cooper stock instead of round results in improved contact consistency and mechanical strength of the compliant pin and socket designs. It is well established that a flat contact for Micro and Nano Connectors are more predictably formed for consistent processing in assembly.

When your design requires high density, high grade .025” pitch interconnect to support your criteria, there is a lot to consider when specifying a “Nano” size connector. Not the least of which is choosing a component that will reduce or eliminate costly delays, redesign and rework. The following whitepaper offers some practical insight that will assist you and your team in making your best, most reliable interconnect choices.